Senseonics Holdings, Inc. (SENS): debt financing — Senseonics draws $10M second tranche of $50M loan from Hercules Capital

Senseonics Holdings, Inc.

Tranche 2 loan of $10M funded on Jan 2, 2024 under existing Loan and Security Agreement.
Initial $25M tranche was funded on Sep 8, 2023; total facility available up to $50M.
Loan is senior secured; conditions for Tranche 2 were satisfied in Q4 2023.

item 2.03

Key facts

Extracted from this filing and checked against the source text.

Debt Financings SEC 8-K Item 2.03/2.04 confidence 0.9

Senseonics Holdings, Inc. incurred term loan of $10.0 million with Hercules Capital, Inc..

Instrument: term loan
Principal: $10.0 million
Counterparty: Hercules Capital, Inc.
Event: incurrence

Exact text from the filing

On January 2, 2024, the Tranche 2 Loan was funded in an amount of $10.0 million following the Company’s satisfaction of certain terms and conditions set forth in the Loan Agreement in the fourth quarter of 2023.

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Senseonics Holdings, Inc. filing history →

Source: SEC EDGAR

accession 0001104659-24-001401

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