{"schema_version":"secwatch.filing_event.v1","accession":"0001104659-25-058741","form_type":"8-K","ticker":"MU","cik":"0000723125","company_name":"MICRON TECHNOLOGY INC","filed_at":"2025-06-12T23:59:59+00:00","discovered_at":"2026-05-14T18:02:51.105564+00:00","generated_at":"2026-05-19T11:46:50.310631+00:00","sec_items":["8.01","9.01"],"event_type":"other_material","sentiment":"positive","materiality_score":0.85,"calibrated_materiality_score":0.85,"confidence":"high","headline":"Micron announces ~$200B U.S. investment in DRAM fabs and R&D; CHIPS grants total $6.44B","bullets":["Plans ~$150B in domestic memory manufacturing and $50B in R&D, creating ~90,000 direct/indirect jobs.","Second leading-edge DRAM fab added in Boise, ID; first fab DRAM output to begin in 2027.","Finalized $275M CHIPS Act award for Virginia fab modernization; adds 1-alpha DRAM node onshoring.","Total CHIPS Act grants up to $6.44B, including $6.1B for Idaho/New York and $275M for Virginia.","Advanced HBM packaging capabilities to be brought to U.S. after second Idaho fab completion."],"urls":{"canonical":"https://secwatch.observer/filing/0001104659-25-058741","json":"https://secwatch.observer/filing/0001104659-25-058741.json","markdown":"https://secwatch.observer/filing/0001104659-25-058741.md","text":"https://secwatch.observer/filing/0001104659-25-058741.txt","edgar_index":"https://www.sec.gov/Archives/edgar/data/723125/000110465925058741/0001104659-25-058741-index.htm","edgar_primary_document":"https://www.sec.gov/Archives/edgar/data/723125/000110465925058741/tm2517778d1_8k.htm"},"model":{"generated_by":"deepseek-v4-flash:cloud@v2","generated_at":"2026-05-19T11:46:50.310631+00:00"},"review":{"review_status":"machine_generated","human_reviewed":false,"corrected":false,"correction_note":null,"correction_timestamp":null,"superseded_by":null,"related_filings":[]},"source_grounded_claims":[],"license":"Source filings: public domain (SEC EDGAR). Summaries (headline + bullets): CC-BY-4.0; attribute https://secwatch.observer"}