{"schema_version":"secwatch.filing_event.v1","accession":"0001104659-25-066576","form_type":"8-K","ticker":"SMTK","cik":"0001817760","company_name":"SmartKem, Inc.","filed_at":"2025-07-09T23:59:59+00:00","discovered_at":"2026-05-14T18:02:45.103551+00:00","generated_at":"2026-05-18T08:55:08.384012+00:00","sec_items":["8.01","9.01"],"event_type":"other_material","sentiment":"neutral","materiality_score":0.55,"calibrated_materiality_score":0.55,"confidence":"medium","headline":"SmartKem signs preliminary JDA with Manz Asia for AI chip packaging dielectric inks","bullets":["Preliminary, non-binding Joint Development Agreement with Manz Asia for dielectric ink solutions in advanced packaging.","Focus on co-developing next-gen dielectric inks for AI chip packaging and 12\" wafer-level and panel-level packaging.","Builds on existing collaboration; first demonstration at SEMICON SEA 2025 of an inkjet metalization process.","No assurance that a definitive development agreement will be executed or as to ultimate terms or outcome."],"urls":{"canonical":"https://secwatch.observer/filing/0001104659-25-066576","json":"https://secwatch.observer/filing/0001104659-25-066576.json","markdown":"https://secwatch.observer/filing/0001104659-25-066576.md","text":"https://secwatch.observer/filing/0001104659-25-066576.txt","edgar_index":"https://www.sec.gov/Archives/edgar/data/1817760/000110465925066576/0001104659-25-066576-index.htm","edgar_primary_document":"https://www.sec.gov/Archives/edgar/data/1817760/000110465925066576/tm2520133d1_8k.htm"},"model":{"generated_by":"deepseek-v4-flash:cloud@v2","generated_at":"2026-05-18T08:55:08.384012+00:00"},"review":{"review_status":"machine_generated","human_reviewed":false,"corrected":false,"correction_note":null,"correction_timestamp":null,"superseded_by":null,"related_filings":[]},"source_grounded_claims":[],"license":"Source filings: public domain (SEC EDGAR). Summaries (headline + bullets): CC-BY-4.0; attribute https://secwatch.observer"}