---
schema_version: "secwatch.filing_event.v1"
accession: "0001104659-25-066576"
form_type: "8-K"
ticker: "SMTK"
cik: "0001817760"
company_name: "SmartKem, Inc."
filed_at: "2025-07-09T23:59:59+00:00"
generated_at: "2026-05-18T08:55:08.384012+00:00"
event_type: "other_material"
sentiment: "neutral"
materiality_score: 0.55
calibrated_materiality_score: 0.55
confidence: "medium"
source: SEC EDGAR
---

# SmartKem signs preliminary JDA with Manz Asia for AI chip packaging dielectric inks

## Summary
- Preliminary, non-binding Joint Development Agreement with Manz Asia for dielectric ink solutions in advanced packaging.
- Focus on co-developing next-gen dielectric inks for AI chip packaging and 12" wafer-level and panel-level packaging.
- Builds on existing collaboration; first demonstration at SEMICON SEA 2025 of an inkjet metalization process.
- No assurance that a definitive development agreement will be executed or as to ultimate terms or outcome.

## SEC filing metadata
- accession: 0001104659-25-066576
- form_type: 8-K
- ticker: SMTK
- cik: 0001817760
- company_name: SmartKem, Inc.
- filed_at: 2025-07-09T23:59:59+00:00
- event_type: other_material
- sentiment: neutral
- materiality_score: 0.55
- calibrated_materiality_score: 0.55
- confidence: medium
- sec_items: 8.01, 9.01
- EDGAR index: https://www.sec.gov/Archives/edgar/data/1817760/000110465925066576/0001104659-25-066576-index.htm
- EDGAR primary document: https://www.sec.gov/Archives/edgar/data/1817760/000110465925066576/tm2520133d1_8k.htm

## Machine-readable alternates
- HTML: https://secwatch.observer/filing/0001104659-25-066576
- JSON: https://secwatch.observer/filing/0001104659-25-066576.json
- Plain text: https://secwatch.observer/filing/0001104659-25-066576.txt

This AI-assisted summary is a reading aid. Review the linked SEC EDGAR filing before relying on any specific claim.