NXP enters into $2.5B amended revolving credit facility due 2027

NXP Semiconductors N.V.

$2.5B senior unsecured revolving commitments; includes $200M letter of credit sub-facility.
Matures August 26, 2027; interest at Term SOFR + 0.10% + margin of 0.875%-1.5%.
Financial covenant: consolidated interest coverage ratio of 3.00 to 1.00 per quarter.
Guaranteed by NXP Semiconductors N.V. and NXP USA, Inc. under amended guaranty.
Proceeds for general corporate purposes and other permitted uses.

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