---
schema_version: "secwatch.filing_event.v1"
accession: "0001193125-23-169669"
form_type: "8-K"
ticker: "TTMI"
cik: "0001116942"
company_name: "TTM TECHNOLOGIES INC"
filed_at: "2023-06-20T23:59:59+00:00"
generated_at: "2026-06-13T20:35:34.159423+00:00"
event_type: "debt"
sentiment: "neutral"
materiality_score: 0.55
calibrated_materiality_score: 0.55
confidence: "high"
source: SEC EDGAR
---

# TTM closes new $150M Asia ABL facility due 2028; margin cut to SOFR+1.3%

## Summary
- New $150M Asia asset-based revolving credit facility matures June 2028, replacing facility due June 2024.
- Borrowing rate reduced to Term SOFR + 1.3% from previous LIBOR + 1.4%.
- $30 million drawn on new facility, same as prior; other facilities mature 2028-2030.
- CFO states capital structure well positioned for next several years.

## SEC filing metadata
- accession: 0001193125-23-169669
- form_type: 8-K
- ticker: TTMI
- cik: 0001116942
- company_name: TTM TECHNOLOGIES INC
- filed_at: 2023-06-20T23:59:59+00:00
- event_type: debt
- sentiment: neutral
- materiality_score: 0.55
- calibrated_materiality_score: 0.55
- confidence: high
- sec_items: 1.01, 2.03, 7.01, 9.01
- EDGAR index: https://www.sec.gov/Archives/edgar/data/1116942/000119312523169669/0001193125-23-169669-index.htm
- EDGAR primary document: https://www.sec.gov/Archives/edgar/data/1116942/000119312523169669/d506021d8k.htm

## Machine-readable alternates
- HTML: https://secwatch.observer/filing/0001193125-23-169669
- JSON: https://secwatch.observer/filing/0001193125-23-169669.json
- Plain text: https://secwatch.observer/filing/0001193125-23-169669.txt

## Key facts
- Debt Financings
  TTM TECHNOLOGIES INC amended credit facility with The Hong Kong and Shanghai Banking Corporation Limited at 1.3% maturing June 13, 2028.
  - Instrument: credit facility
  - Counterparty: The Hong Kong and Shanghai Banking Corporation Limited
  - Rate: 1.3%
  - Maturity: June 13, 2028
  - Event: amendment
  source text: On June 14, 2023, TTM Technologies China Limited (“TTMC”) and TTM Technologies Trading (Asia) Company Limited (“TTMTA”), each of which are wholly-owned subsidiaries of TTM Technologies, Inc. (the “Company”), entered into an amended and restated facility agreement, effective as of June 30, 2023 (the “Facility Agreement”), which amends and restates the Asia asset backed loan facility agreement dated May 22, 2015 and amended and restated on June 4, 2019 (the “Asia ABL Agreement”) entered into by and among TTMC, TTMTA and other parties as original guarantors, The Hong Kong and Shanghai Banking Corporation Limited as arranger, original lender, facility agent, security trustee and issuing bank and Barclays Bank PLC as original lender.
  evidence_url: https://www.sec.gov/Archives/edgar/data/1116942/000119312523169669/0001193125-23-169669-index.htm
- Material Agreements
  TTM TECHNOLOGIES INC amended Facility Agreement with The Hong Kong and Shanghai Banking Corporation Limited (effective 2023-06-30).
  - Action: amendment
  - Agreement: credit facility
  - Counterparty: The Hong Kong and Shanghai Banking Corporation Limited
  - Effective: 2023-06-30
  source text: On June 14, 2023, TTM Technologies China Limited (“TTMC”) and TTM Technologies Trading (Asia) Company Limited (“TTMTA”), each of which are wholly-owned subsidiaries of TTM Technologies, Inc. (the “Company”), entered into an amended and restated facility agreement, effective as of June 30, 2023 (the “Facility Agreement”), which amends and restates the Asia asset backed loan facility agreement dated May 22, 2015 and amended and restated on June 4, 2019 (the “Asia ABL Agreement”) entered into by and among TTMC, TTMTA and other parties as original guarantors, The Hong Kong and Shanghai Banking Corporation Limited as arranger, original lender, facility agent, security trustee and issuing bank and Barclays Bank PLC as original lender.
  evidence_url: https://www.sec.gov/Archives/edgar/data/1116942/000119312523169669/0001193125-23-169669-index.htm

This AI-assisted summary is a reading aid. Review the linked SEC EDGAR filing before relying on any specific claim.