secwatch.observer — SEC 8-K summary
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Issuer:     HPS Corporate Lending Fund (—)
CIK:        0001838126
Form:       8-K
Filed at:   2023-07-17T23:59:59+00:00
Accession:  0001193125-23-188150
Event type: debt
Sentiment:  neutral
Materiality: 0.50
Item codes: 1.01, 2.03, 9.01
LLM model:  deepseek-v4-flash:cloud@v2

HPS Corporate Lending Fund boosts credit facility commitments by $150M to $1.275B
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- Aggregate commitments increased from $1.125B to $1.275B via accordion feature.
- Maximum potential commitments under facility remain $1.85B.
- Three lenders each added $50M: BNP Paribas, Sumitomo Mitsui Banking Corp, Bank of America.
- Increase effective July 12, 2023; governed by existing credit agreement.

Source:
  EDGAR index:    https://www.sec.gov/Archives/edgar/data/1838126/000119312523188150/0001193125-23-188150-index.htm
  Primary doc:    https://www.sec.gov/Archives/edgar/data/1838126/000119312523188150/d508634d8k.htm
  HTML page:      https://secwatch.observer/filing/0001193125-23-188150

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