SDG&E closes $600M offering of 5.550% First Mortgage Bonds due 2054

SEMPRA

Issued $600M aggregate principal of 5.550% First Mortgage Bonds, Series BBBB, due April 15, 2054.
Proceeds to company at 98.109% of principal; after underwriting discount and ~$1.5M expenses.
Interest payable semiannually on April 15 and October 15, beginning October 15, 2024.
Bonds are redeemable prior to maturity; terms in Seventy-Sixth Supplemental Indenture.
Offering registered under Sempra's existing shelf registration (File No. 333-269677).

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