---
schema_version: "secwatch.filing_event.v1"
accession: "0001193125-25-005299"
form_type: "8-K"
ticker: "NXPI"
cik: "0001413447"
company_name: "NXP Semiconductors N.V."
filed_at: "2025-01-13T23:59:59+00:00"
generated_at: "2026-05-28T03:04:15.209829+00:00"
event_type: "debt"
sentiment: "neutral"
materiality_score: 0.3
calibrated_materiality_score: 0.3
confidence: "high"
source: SEC EDGAR
---

# NXP secures €360M EIB loan for semiconductor R&D in Europe

## Summary
- Facility with European Investment Bank provides €360M unsecured senior loan for R&D in five European countries.
- Loan may be EUR or USD denominated, fixed or floating rate, with tenor up to six years.
- Obligations guaranteed by NXP Semiconductors N.V., NXP Funding LLC, and NXP USA, Inc.
- Covenants and events of default consistent with NXP's existing $2.0B revolving credit agreement.
- Borrowings will fund research, development, and innovation of semiconductor devices, technologies, and solutions.

## SEC filing metadata
- accession: 0001193125-25-005299
- form_type: 8-K
- ticker: NXPI
- cik: 0001413447
- company_name: NXP Semiconductors N.V.
- filed_at: 2025-01-13T23:59:59+00:00
- event_type: debt
- sentiment: neutral
- materiality_score: 0.3
- calibrated_materiality_score: 0.3
- confidence: high
- sec_items: 1.01, 2.03, 9.01
- EDGAR index: https://www.sec.gov/Archives/edgar/data/1413447/000119312525005299/0001193125-25-005299-index.htm
- EDGAR primary document: https://www.sec.gov/Archives/edgar/data/1413447/000119312525005299/d896442d8k.htm

## Machine-readable alternates
- HTML: https://secwatch.observer/filing/0001193125-25-005299
- JSON: https://secwatch.observer/filing/0001193125-25-005299.json
- Plain text: https://secwatch.observer/filing/0001193125-25-005299.txt

This AI-assisted summary is a reading aid. Review the linked SEC EDGAR filing before relying on any specific claim.