---
schema_version: "secwatch.filing_event.v1"
accession: "0001193125-25-080269"
form_type: "8-K"
ticker: "AMAT"
cik: "0000006951"
company_name: "APPLIED MATERIALS INC /DE"
filed_at: "2025-04-14T23:59:59+00:00"
generated_at: "2026-05-23T15:51:02.221102+00:00"
event_type: "m_and_a"
sentiment: "positive"
materiality_score: 0.7
calibrated_materiality_score: 0.7
confidence: "high"
source: SEC EDGAR
---

# Applied Materials buys 9% stake in BE Semiconductor Industries to boost hybrid bonding

## Summary
- Purchased 9% of Besi's outstanding common stock through market-based transactions; no regulatory approvals needed.
- Companies have collaborated since 2020 on hybrid bonding; recently extended co-development agreement for die-based hybrid bonding.
- Applied does not intend to seek board representation or purchase additional Besi shares.
- Hybrid bonding critical for advanced packaging of AI chips, improving performance, power, and cost.

## SEC filing metadata
- accession: 0001193125-25-080269
- form_type: 8-K
- ticker: AMAT
- cik: 0000006951
- company_name: APPLIED MATERIALS INC /DE
- filed_at: 2025-04-14T23:59:59+00:00
- event_type: m_and_a
- sentiment: positive
- materiality_score: 0.7
- calibrated_materiality_score: 0.7
- confidence: high
- sec_items: 8.01, 9.01
- EDGAR index: https://www.sec.gov/Archives/edgar/data/6951/000119312525080269/0001193125-25-080269-index.htm
- EDGAR primary document: https://www.sec.gov/Archives/edgar/data/6951/000119312525080269/d939298d8k.htm

## Machine-readable alternates
- HTML: https://secwatch.observer/filing/0001193125-25-080269
- JSON: https://secwatch.observer/filing/0001193125-25-080269.json
- Plain text: https://secwatch.observer/filing/0001193125-25-080269.txt

This AI-assisted summary is a reading aid. Review the linked SEC EDGAR filing before relying on any specific claim.