{"schema_version":"secwatch.filing_event.v1","accession":"0001193125-25-180358","form_type":"8-K","ticker":"REZI","cik":"0001740332","company_name":"RESIDEO TECHNOLOGIES, INC.","filed_at":"2025-08-14T23:59:59+00:00","discovered_at":"2026-05-14T18:02:44.850354+00:00","generated_at":"2026-05-17T13:18:25.687863+00:00","sec_items":["1.01","1.02","2.03","7.01","9.01"],"event_type":"other_material","sentiment":"positive","materiality_score":0.85,"calibrated_materiality_score":0.85,"confidence":"high","headline":"Resideo completes $1.59B Honeywell payment, eliminates $140M annual obligations; issues $1.225B debt","bullets":["Paid $1.59B to Honeywell to terminate Indemnification Agreement; eliminates up to $140M annual payments through 2043.","Issued $1.225B incremental term loans at SOFR+2.00%, maturing August 13, 2032.","Interest rate on existing Term B loans increased from SOFR+1.75% to SOFR+2.00%.","Total leverage ratio covenant temporarily raised to 4.00x for Q3 and Q4 2025.","Other Honeywell agreements, including Honeywell Home brand license, remain in effect."],"urls":{"canonical":"https://secwatch.observer/filing/0001193125-25-180358","json":"https://secwatch.observer/filing/0001193125-25-180358.json","markdown":"https://secwatch.observer/filing/0001193125-25-180358.md","text":"https://secwatch.observer/filing/0001193125-25-180358.txt","edgar_index":"https://www.sec.gov/Archives/edgar/data/1740332/000119312525180358/0001193125-25-180358-index.htm","edgar_primary_document":"https://www.sec.gov/Archives/edgar/data/1740332/000119312525180358/d77968d8k.htm"},"model":{"generated_by":"deepseek-v4-flash:cloud@v2","generated_at":"2026-05-17T13:18:25.687863+00:00"},"review":{"review_status":"machine_generated","human_reviewed":false,"corrected":false,"correction_note":null,"correction_timestamp":null,"superseded_by":null,"related_filings":[]},"source_grounded_claims":[{"claim_id":"27a473db4e6b5c7a2b54db7d05a4e3d2c320d387","claim":"RESIDEO TECHNOLOGIES, INC. amended credit facility with JPMorgan Chase Bank, N.A. at Term SOFR plus 2.00%.","evidence_excerpt":"increase the interest rate on the Existing Term B Tranches from Term SOFR plus 1.75% to Term SOFR plus 2.00%","evidence_source":"SEC 8-K Item 2.03/2.04","evidence_url":"https://www.sec.gov/Archives/edgar/data/1740332/000119312525180358/0001193125-25-180358-index.htm","confidence":0.9,"family_label":"Debt Financings","details":[{"label":"Instrument","value":"credit facility"},{"label":"Counterparty","value":"JPMorgan Chase Bank, N.A."},{"label":"Rate","value":"Term SOFR plus 2.00%"},{"label":"Event","value":"amendment"}],"fact_type":"debt_financing"},{"claim_id":"373fe840761e4138e582060884ae9f202729ae60","claim":"RESIDEO TECHNOLOGIES, INC. incurred term loan of $1.225 billion with JPMorgan Chase Bank, N.A. at Term SOFR plus 2.00% maturing August 13, 2032.","evidence_excerpt":"the Company obtained incremental senior secured term loans with a seven-year maturity and an interest rate of Term SOFR plus 2.00% in an aggregate principal amount of $1.225 billion","evidence_source":"SEC 8-K Item 2.03/2.04","evidence_url":"https://www.sec.gov/Archives/edgar/data/1740332/000119312525180358/0001193125-25-180358-index.htm","confidence":0.9,"family_label":"Debt Financings","details":[{"label":"Instrument","value":"term loan"},{"label":"Principal","value":"$1.225 billion"},{"label":"Counterparty","value":"JPMorgan Chase Bank, N.A."},{"label":"Rate","value":"Term SOFR plus 2.00%"},{"label":"Maturity","value":"August 13, 2032"},{"label":"Event","value":"incurrence"}],"fact_type":"debt_financing"}],"license":"Source filings: public domain (SEC EDGAR). Summaries (headline + bullets): CC-BY-4.0; attribute https://secwatch.observer"}