---
schema_version: "secwatch.filing_event.v1"
accession: "0001193125-25-180358"
form_type: "8-K"
ticker: "REZI"
cik: "0001740332"
company_name: "RESIDEO TECHNOLOGIES, INC."
filed_at: "2025-08-14T23:59:59+00:00"
generated_at: "2026-05-17T13:18:25.687863+00:00"
event_type: "other_material"
sentiment: "positive"
materiality_score: 0.85
calibrated_materiality_score: 0.85
confidence: "high"
source: SEC EDGAR
---

# Resideo completes $1.59B Honeywell payment, eliminates $140M annual obligations; issues $1.225B debt

## Summary
- Paid $1.59B to Honeywell to terminate Indemnification Agreement; eliminates up to $140M annual payments through 2043.
- Issued $1.225B incremental term loans at SOFR+2.00%, maturing August 13, 2032.
- Interest rate on existing Term B loans increased from SOFR+1.75% to SOFR+2.00%.
- Total leverage ratio covenant temporarily raised to 4.00x for Q3 and Q4 2025.
- Other Honeywell agreements, including Honeywell Home brand license, remain in effect.

## SEC filing metadata
- accession: 0001193125-25-180358
- form_type: 8-K
- ticker: REZI
- cik: 0001740332
- company_name: RESIDEO TECHNOLOGIES, INC.
- filed_at: 2025-08-14T23:59:59+00:00
- event_type: other_material
- sentiment: positive
- materiality_score: 0.85
- calibrated_materiality_score: 0.85
- confidence: high
- sec_items: 1.01, 1.02, 2.03, 7.01, 9.01
- EDGAR index: https://www.sec.gov/Archives/edgar/data/1740332/000119312525180358/0001193125-25-180358-index.htm
- EDGAR primary document: https://www.sec.gov/Archives/edgar/data/1740332/000119312525180358/d77968d8k.htm

## Machine-readable alternates
- HTML: https://secwatch.observer/filing/0001193125-25-180358
- JSON: https://secwatch.observer/filing/0001193125-25-180358.json
- Plain text: https://secwatch.observer/filing/0001193125-25-180358.txt

## Key facts
- Debt Financings
  RESIDEO TECHNOLOGIES, INC. amended credit facility with JPMorgan Chase Bank, N.A. at Term SOFR plus 2.00%.
  - Instrument: credit facility
  - Counterparty: JPMorgan Chase Bank, N.A.
  - Rate: Term SOFR plus 2.00%
  - Event: amendment
  source text: increase the interest rate on the Existing Term B Tranches from Term SOFR plus 1.75% to Term SOFR plus 2.00%
  evidence_url: https://www.sec.gov/Archives/edgar/data/1740332/000119312525180358/0001193125-25-180358-index.htm
- Debt Financings
  RESIDEO TECHNOLOGIES, INC. incurred term loan of $1.225 billion with JPMorgan Chase Bank, N.A. at Term SOFR plus 2.00% maturing August 13, 2032.
  - Instrument: term loan
  - Principal: $1.225 billion
  - Counterparty: JPMorgan Chase Bank, N.A.
  - Rate: Term SOFR plus 2.00%
  - Maturity: August 13, 2032
  - Event: incurrence
  source text: the Company obtained incremental senior secured term loans with a seven-year maturity and an interest rate of Term SOFR plus 2.00% in an aggregate principal amount of $1.225 billion
  evidence_url: https://www.sec.gov/Archives/edgar/data/1740332/000119312525180358/0001193125-25-180358-index.htm

This AI-assisted summary is a reading aid. Review the linked SEC EDGAR filing before relying on any specific claim.