SDG&E closes $1.1B debt offering in two tranches maturing 2036 and 2056

SEMPRA

Issued $625M of 5.200% First Mortgage Bonds, Series DDDD, due March 15, 2036.
Issued $475M of 5.950% First Mortgage Bonds, Series EEEE, due March 15, 2056.
Proceeds to SDG&E after underwriting discount but before ~$2.6M other expenses: 99.104% and 98.517% of par, respectively.
Interest on both series payable semiannually starting September 15, 2026.
Offering closed March 20, 2026; bonds registered under S-3 (File 333-269677).

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