{"schema_version":"secwatch.filing_event.v1","accession":"0001213900-26-083005","form_type":"8-K","ticker":"ALMU","cik":"0001828805","company_name":"Aeluma, Inc.","filed_at":"2026-07-30T01:37:45+00:00","discovered_at":"2026-07-30T10:05:00.260508+00:00","generated_at":"2026-07-30T10:05:37.072294+00:00","sec_items":["7.01","9.01"],"event_type":"regulatory","sentiment":"positive","materiality_score":0.75,"calibrated_materiality_score":0.75,"confidence":"high","headline":"Aeluma signs CHIPS Act LOI for up to $30M from U.S. Department of Commerce for photonics R&D","bullets":["Signed LOI with U.S. Department of Commerce for up to $30M in CHIPS Act funding for R&D of non-InP photonics platform.","Funding aims to accelerate scalable manufacturing of photonic components for AI datacom, addressing supply chain constraints.","Award subject to due diligence, government approvals, and execution of definitive documents; portion funded upfront, rest milestone-based.","Aeluma would issue equity securities to Department of Commerce equal to award amount upon finalization.","Company's non-InP large-diameter substrate platform (up to 300mm) targets high-speed photodetectors and lasers for AI interconnects."],"urls":{"canonical":"https://secwatch.observer/filing/0001213900-26-083005","json":"https://secwatch.observer/filing/0001213900-26-083005.json","markdown":"https://secwatch.observer/filing/0001213900-26-083005.md","text":"https://secwatch.observer/filing/0001213900-26-083005.txt","edgar_index":"https://www.sec.gov/Archives/edgar/data/1828805/000121390026083005/0001213900-26-083005-index.htm","edgar_primary_document":"https://www.sec.gov/Archives/edgar/data/1828805/000121390026083005/ea0299786-8k_aeluma.htm"},"model":{"generated_by":"deepseek-v4-flash:cloud@v2","generated_at":"2026-07-30T10:05:37.072294+00:00"},"review":{"review_status":"machine_generated","human_reviewed":false,"corrected":false,"correction_note":null,"correction_timestamp":null,"superseded_by":null,"related_filings":[]},"source_grounded_claims":[],"license":"Source filings: public domain (SEC EDGAR). Summaries (headline + bullets): CC-BY-4.0; attribute https://secwatch.observer"}