---
schema_version: "secwatch.filing_event.v1"
accession: "0001413447-24-000066"
form_type: "8-K"
ticker: "NXPI"
cik: "0001413447"
company_name: "NXP Semiconductors N.V."
filed_at: "2024-06-05T23:59:59+00:00"
generated_at: "2026-06-01T06:13:48.716332+00:00"
event_type: "m_and_a"
sentiment: "neutral"
materiality_score: 0.7
calibrated_materiality_score: 0.7
confidence: "high"
source: SEC EDGAR
---

# NXP and VIS announce $7.8B joint venture to build 300mm wafer fab in Singapore

## Summary
- NXP to invest $1.6B for 40% equity in JV VisionPower Semiconductor; VIS invests $2.4B for 60%.
- Total initial build-out cost $7.8B; additional $1.9B committed for long-term capacity infrastructure.
- Construction starts H2 2024; initial production target 2027; full capacity 55k wafers/month by 2029.
- Fab will produce 130nm to 40nm mixed-signal/analog chips for automotive, industrial, consumer, mobile markets.
- JV to create ~1,500 jobs in Singapore; technology licensed from TSMC.

## SEC filing metadata
- accession: 0001413447-24-000066
- form_type: 8-K
- ticker: NXPI
- cik: 0001413447
- company_name: NXP Semiconductors N.V.
- filed_at: 2024-06-05T23:59:59+00:00
- event_type: m_and_a
- sentiment: neutral
- materiality_score: 0.7
- calibrated_materiality_score: 0.7
- confidence: high
- sec_items: 8.01, 9.01
- EDGAR index: https://www.sec.gov/Archives/edgar/data/1413447/000141344724000066/0001413447-24-000066-index.htm
- EDGAR primary document: https://www.sec.gov/Archives/edgar/data/1413447/000141344724000066/nxpi-20240605.htm

## Machine-readable alternates
- HTML: https://secwatch.observer/filing/0001413447-24-000066
- JSON: https://secwatch.observer/filing/0001413447-24-000066.json
- Plain text: https://secwatch.observer/filing/0001413447-24-000066.txt

This AI-assisted summary is a reading aid. Review the linked SEC EDGAR filing before relying on any specific claim.