---
schema_version: "secwatch.filing_event.v1"
accession: "0001413447-26-000051"
form_type: "8-K"
ticker: "NXPI"
cik: "0001413447"
company_name: "NXP Semiconductors N.V."
filed_at: "2026-09-02T20:02:36+00:00"
generated_at: "2026-09-02T20:04:23.297017+00:00"
event_type: "debt"
sentiment: "neutral"
materiality_score: 0.5
calibrated_materiality_score: 0.5
confidence: "high"
source: SEC EDGAR
---

# NXP enters $250M EIB facility to expand Malaysia back-end manufacturing

## Summary
- NXP B.V., a wholly owned direct subsidiary of NXP Semiconductors N.V. (NXPI), entered a $250.0M unsecured senior loan facility with the European Investment Bank (EIB) on Sept 1, 2026.
- Proceeds will fund design and implementation of an expansion of an existing semiconductor assembly and test (back-end) facility in Kuala Lumpur, Malaysia.
- The facility is fully and unconditionally guaranteed by NXP Semiconductors N.V., NXP Funding LLC, and NXP USA, Inc.
- Borrowings may be USD or EUR denominated, carry fixed or floating rates, and have a maximum tenor of six years.

## SEC filing metadata
- accession: 0001413447-26-000051
- form_type: 8-K
- ticker: NXPI
- cik: 0001413447
- company_name: NXP Semiconductors N.V.
- filed_at: 2026-09-02T20:02:36+00:00
- event_type: debt
- sentiment: neutral
- materiality_score: 0.5
- calibrated_materiality_score: 0.5
- confidence: high
- sec_items: 1.01, 2.03, 9.01
- EDGAR index: https://www.sec.gov/Archives/edgar/data/1413447/000141344726000051/0001413447-26-000051-index.htm
- EDGAR primary document: https://www.sec.gov/Archives/edgar/data/1413447/000141344726000051/nxpi-20260901.htm

## Machine-readable alternates
- HTML: https://secwatch.observer/filing/0001413447-26-000051
- JSON: https://secwatch.observer/filing/0001413447-26-000051.json
- Plain text: https://secwatch.observer/filing/0001413447-26-000051.txt

This AI-assisted summary is a reading aid. Review the linked SEC EDGAR filing before relying on any specific claim.