{"schema_version":"secwatch.filing_event.v1","accession":"0001628280-26-024696","form_type":"8-K","ticker":"MRAM","cik":"0001438423","company_name":"EVERSPIN TECHNOLOGIES INC.","filed_at":"2026-04-10T23:59:59+00:00","discovered_at":"2026-05-14T18:02:32.292707+00:00","generated_at":"2026-05-15T06:40:06.316990+00:00","sec_items":["1.01","7.01","9.01"],"event_type":"other_material","sentiment":"positive","materiality_score":0.75,"calibrated_materiality_score":0.75,"confidence":"high","headline":"Everspin signs 10-year foundry deal with Microchip for on-shore MRAM wafer production in Oregon","bullets":["10-year foundry deal with Microchip Technology for 8-inch MRAM, TMR sensor, and STT-MRAM wafers at Microchip's Oregon Fab 4.","Everspin to reimburse Microchip estimated $13.95M in two phases for tooling relocation, setup, and qualification costs.","First product shipments expected H2 2027; Toggle/Sensor wafer capacity in ~18 months, STT capacity in ~30 months from April 8, 2026.","Minimum purchase commitments ramp to 1,300 wafers per quarter; shortfall payment required in cash within 45 days.","Everspin retains ownership of product-design IP; Microchip owns process-technology IP; mutual cross-licenses for respective fields."],"urls":{"canonical":"https://secwatch.observer/filing/0001628280-26-024696","json":"https://secwatch.observer/filing/0001628280-26-024696.json","markdown":"https://secwatch.observer/filing/0001628280-26-024696.md","text":"https://secwatch.observer/filing/0001628280-26-024696.txt","edgar_index":"https://www.sec.gov/Archives/edgar/data/1438423/000162828026024696/0001628280-26-024696-index.htm","edgar_primary_document":"https://www.sec.gov/Archives/edgar/data/1438423/000162828026024696/mram-20260408.htm"},"model":{"generated_by":"deepseek-v4-flash:cloud@v2","generated_at":"2026-05-15T06:40:06.316990+00:00"},"review":{"review_status":"machine_generated","human_reviewed":false,"corrected":false,"correction_note":null,"correction_timestamp":null,"superseded_by":null,"related_filings":[]},"source_grounded_claims":[{"claim_id":"5e050e46d5ab8cb0aa31480238a4be26c412c53f","claim":"EVERSPIN TECHNOLOGIES INC. entered into Foundry Services Agreement with Microchip Technology valued at Estimated total reimbursement of approximately $13.95 million in two phases for costs; minimum purch (effective 2026-04-08).","evidence_excerpt":"On April 8, 2026, Everspin Technologies, Inc. (the “Company”) and Microchip Technology (“Microchip”) entered into a Foundry Services Agreement (the “Agreement”). Under the Agreement, Microchip will manufacture 8-inch Magnetoresistive Random Access Memory (“MRAM”), Tunnel Magnetoresistive (“TMR”) sensor, and Spin-transfer Torque (“STT”) MRAM wafers for the Company at Microchip’s Fab 4 facility located in Gresham, Oregon.","evidence_source":"SEC 8-K Item 1.01/1.02","evidence_url":"https://www.sec.gov/Archives/edgar/data/1438423/000162828026024696/0001628280-26-024696-index.htm","confidence":0.9,"family_label":"Material Agreements","details":[{"label":"Action","value":"entry"},{"label":"Agreement","value":"supply"},{"label":"Counterparty","value":"Microchip Technology"},{"label":"Value","value":"Estimated total reimbursement of approximately $13.95 million in two phases for costs; minimum purch"},{"label":"Effective","value":"2026-04-08"}],"fact_type":"material_agreement"}],"license":"Source filings: public domain (SEC EDGAR). Summaries (headline + bullets): CC-BY-4.0; attribute https://secwatch.observer"}