---
schema_version: "secwatch.filing_event.v1"
accession: "0001628280-26-034090"
form_type: "8-K"
ticker: "AOSL"
cik: "0001387467"
company_name: "ALPHA & OMEGA SEMICONDUCTOR Ltd"
filed_at: "2026-05-12T20:05:34+00:00"
generated_at: "2026-05-15T02:23:45.269781+00:00"
event_type: "m_and_a"
sentiment: "positive"
materiality_score: 0.5
calibrated_materiality_score: 0.5
confidence: "high"
source: SEC EDGAR
---

# AOSL completes sale of ~20.3% JV stake for $150M; final installment received May 11, 2026

## Summary
- Received final USD $150M installment from SIMIC Holdings on May 11, 2026, closing the transaction.
- Sold approximately 20.3% equity interest in power semiconductor JV (packaging, testing, 12-inch fab) in Chongqing.
- Aggregate cash consideration of $150M paid in four installments; no further payment obligations.
- Previously disclosed equity transfer agreement dated July 14, 2025; transaction now complete.

## SEC filing metadata
- accession: 0001628280-26-034090
- form_type: 8-K
- ticker: AOSL
- cik: 0001387467
- company_name: ALPHA & OMEGA SEMICONDUCTOR Ltd
- filed_at: 2026-05-12T20:05:34+00:00
- event_type: m_and_a
- sentiment: positive
- materiality_score: 0.5
- calibrated_materiality_score: 0.5
- confidence: high
- sec_items: 2.01, 9.01
- EDGAR index: https://www.sec.gov/Archives/edgar/data/1387467/000162828026034090/0001628280-26-034090-index.htm
- EDGAR primary document: https://www.sec.gov/Archives/edgar/data/1387467/000162828026034090/aosl-20260511.htm

## Machine-readable alternates
- HTML: https://secwatch.observer/filing/0001628280-26-034090
- JSON: https://secwatch.observer/filing/0001628280-26-034090.json
- Plain text: https://secwatch.observer/filing/0001628280-26-034090.txt

## Key facts
- M&A Transactions
  ALPHA & OMEGA SEMICONDUCTOR Ltd completed a disposition involving SIMIC Holdings Co., Ltd. for USD $150 million (closed 2026-05-11).
  - Action: disposition
  - Counterparty: SIMIC Holdings Co., Ltd.
  - Consideration: USD $150 million
  - Closing: 2026-05-11
  source text: testing and 12-inch wafer fabrication facility located in Chongqing, China (the “ Transaction ”). The aggregate cash consideration for the sale under the Agreement was USD $150 million (the “ Purchase Price ”) to be paid in four installments. The Company received the last installment of the Purchase Price from the Investor on May 11, 2026, and the Transaction
  evidence_url: https://www.sec.gov/Archives/edgar/data/1387467/000162828026034090/0001628280-26-034090-index.htm

This AI-assisted summary is a reading aid. Review the linked SEC EDGAR filing before relying on any specific claim.