D-Wave announces cryogenic packaging initiative leveraging JPL bump-bond process, targeting 100K qubits

D-Wave Quantum Inc.

Initiative focuses on advanced cryogenic packaging to scale both annealing and gate-model quantum processors.
Leveraging NASA JPL's superconducting bump-bond process; demonstrated end-to-end superconducting interconnect between chips.
Acquiring equipment to increase circuit densities in superconducting PCB manufacturing for larger processors.
Aims to accelerate product roadmap toward 100,000 qubits per Dr. Trevor Lanting, chief development officer.

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