---
schema_version: "secwatch.filing_event.v1"
accession: "0001907982-25-000166"
form_type: "8-K"
ticker: "QBTS"
cik: "0001907982"
company_name: "D-Wave Quantum Inc."
filed_at: "2025-07-30T23:59:59+00:00"
generated_at: "2026-05-17T23:12:20.619801+00:00"
event_type: "other_material"
sentiment: "positive"
materiality_score: 0.5
calibrated_materiality_score: 0.5
confidence: "high"
source: SEC EDGAR
---

# D-Wave announces cryogenic packaging initiative leveraging JPL bump-bond process, targeting 100K qubits

## Summary
- Initiative focuses on advanced cryogenic packaging to scale both annealing and gate-model quantum processors.
- Leveraging NASA JPL's superconducting bump-bond process; demonstrated end-to-end superconducting interconnect between chips.
- Acquiring equipment to increase circuit densities in superconducting PCB manufacturing for larger processors.
- Aims to accelerate product roadmap toward 100,000 qubits per Dr. Trevor Lanting, chief development officer.

## SEC filing metadata
- accession: 0001907982-25-000166
- form_type: 8-K
- ticker: QBTS
- cik: 0001907982
- company_name: D-Wave Quantum Inc.
- filed_at: 2025-07-30T23:59:59+00:00
- event_type: other_material
- sentiment: positive
- materiality_score: 0.5
- calibrated_materiality_score: 0.5
- confidence: high
- sec_items: 7.01, 9.01
- EDGAR index: https://www.sec.gov/Archives/edgar/data/1907982/000190798225000166/0001907982-25-000166-index.htm
- EDGAR primary document: https://www.sec.gov/Archives/edgar/data/1907982/000190798225000166/qbts-20250730.htm

## Machine-readable alternates
- HTML: https://secwatch.observer/filing/0001907982-25-000166
- JSON: https://secwatch.observer/filing/0001907982-25-000166.json
- Plain text: https://secwatch.observer/filing/0001907982-25-000166.txt

This AI-assisted summary is a reading aid. Review the linked SEC EDGAR filing before relying on any specific claim.