Extracted from this filing and checked against the source text.
Debt Financings
SEC 8-K Item 2.03/2.04
confidence 0.95
TTM TECHNOLOGIES INC incurred revolving credit of $150.0 million with JPMorgan Chase Bank, N.A. at Term SOFR plus a margin ranging from 1.35% to 1.60% maturing May 2028.
- Instrument
- revolving credit
- Principal
- $150.0 million
- Counterparty
- JPMorgan Chase Bank, N.A.
- Rate
- Term SOFR plus a margin ranging from 1.35% to 1.60%
- Maturity
- May 2028
- Event
- incurrence
Exact text from the filing
ABL Credit Agreement On May 30, 2023, the Company entered into an Amended & Restated ABL Credit Agreement by and among the Company, the several lenders from time to time parties thereto, JPMorgan Chase Bank, N.A., as Administrative Agent, Barclays Bank PLC, Bank of America, N.A. and Truist Securities, Inc. as Syndication Agents, and HSBC Securities (USA) Inc., as Documentation Agent (the “U.S. ABL Credit Agreement”). The U.S. ABL Credit Agreement provides for a U.S. asset-based revolving credit facility with committed maximum borrowing capacity of $150.0 million (the “New U.S. ABL Facility”) that amends and restates the Company’s existing $150.0 million U.S. asset-based revolving credit facility, which was scheduled to mature in June 2024. The New U.S. ABL Facility includes a letter of credit subfacility with a sublimit of $50 million, provided that at no time may amounts outstanding under the New U.S. ABL Facility exceed in the aggregate $150.0 million or the New U.S. ABL Facility bor
View on SEC.gov
Debt Financings
SEC 8-K Item 2.03/2.04
confidence 0.95
TTM TECHNOLOGIES INC incurred term loan of $350.0 million with JPMorgan Chase Bank, N.A. at Term SOFR plus a margin of 2.75% maturing May 2030.
- Instrument
- term loan
- Principal
- $350.0 million
- Counterparty
- JPMorgan Chase Bank, N.A.
- Rate
- Term SOFR plus a margin of 2.75%
- Maturity
- May 2030
- Event
- incurrence
Exact text from the filing
Term Loan Credit Agreement On May 30, 2023 (the “Closing Date”), TTM Technologies, Inc. (the “Company”) entered into an Amended & Restated Term Loan Credit Agreement by and among the Company, JPMorgan Chase Bank, N.A., as Administrative Agent, and the several lenders from time to time parties thereto (the “Term Loan Credit Agreement”). The Term Loan Credit Agreement provides for a $350.0 million senior secured term loan credit facility (the “New Term Loan Facility”) that amends and restates the Company’s existing senior secured term loan credit facility that was due to expire in September 2024, under which $355.9 million of indebtedness was outstanding. In addition, the Term Loan Credit Agreement will permit the Company to add one or more senior secured incremental term loan facilities to the New Term Loan Facility subject to the satisfaction of certain conditions. On the Closing Date, the Company used $350.0 million under the New Term Loan Facility, together with cash on hand, to refi
View on SEC.gov
Material Agreements
SEC 8-K Item 1.01/1.02
confidence 0.9
TTM TECHNOLOGIES INC entered into "U.S. ABL Credit Agreement" with JPMorgan Chase Bank, N.A., as Administrative Agent, Barclays Bank PLC, Bank of America, N.A. and Truist Securities, Inc. as Syndication Agents, and HSBC Securities (USA) Inc., as Documentation Agent valued at $150.0 million (effective 2023-05-30).
- Action
- entry
- Agreement
- credit facility
- Counterparty
- JPMorgan Chase Bank, N.A., as Administrative Agent, Barclays Bank PLC, Bank of America, N.A. and Truist Securities, Inc. as Syndication Agents, and HSBC Securities (USA) Inc., as Documentation Agent
- Value
- $150.0 million
- Effective
- 2023-05-30
Exact text from the filing
On May 30, 2023, the Company entered into an Amended & Restated ABL Credit Agreement by and among the Company, the several lenders from time to time parties thereto, JPMorgan Chase Bank, N.A., as Administrative Agent, Barclays Bank PLC, Bank of America, N.A. and Truist Securities, Inc. as Syndication Agents, and HSBC Securities (USA) Inc., as Documentation Agent (the “U.S. ABL Credit Agreement”).
View on SEC.gov
Material Agreements
SEC 8-K Item 1.01/1.02
confidence 0.9
TTM TECHNOLOGIES INC entered into "Term Loan Credit Agreement" with JPMorgan Chase Bank, N.A., as Administrative Agent, and the several lenders from time to time parties thereto valued at $350.0 million (effective 2023-05-30).
- Action
- entry
- Agreement
- credit facility
- Counterparty
- JPMorgan Chase Bank, N.A., as Administrative Agent, and the several lenders from time to time parties thereto
- Value
- $350.0 million
- Effective
- 2023-05-30
Exact text from the filing
On May 30, 2023 (the “Closing Date”), TTM Technologies, Inc. (the “Company”) entered into an Amended & Restated Term Loan Credit Agreement by and among the Company, JPMorgan Chase Bank, N.A., as Administrative Agent, and the several lenders from time to time parties thereto (the “Term Loan Credit Agreement”).
View on SEC.gov