secwatch / observer
8-K filed May 30, 2023, 7:59 PM ET ticker TTMI CIK 0001116942
debt confidence high sentiment neutral materiality 0.50

TTM TECHNOLOGIES INC (TTMI): debt financing — TTM refinances $350M term loan and $150M ABL facility, extending maturities to 2030/2028

TTM TECHNOLOGIES INC

Key facts

Extracted from this filing and checked against the source text.

Debt Financings SEC 8-K Item 2.03/2.04 confidence 0.95

TTM TECHNOLOGIES INC incurred revolving credit of $150.0 million with JPMorgan Chase Bank, N.A. at Term SOFR plus a margin ranging from 1.35% to 1.60% maturing May 2028.

Instrument
revolving credit
Principal
$150.0 million
Counterparty
JPMorgan Chase Bank, N.A.
Rate
Term SOFR plus a margin ranging from 1.35% to 1.60%
Maturity
May 2028
Event
incurrence
Exact text from the filing
ABL Credit Agreement On May 30, 2023, the Company entered into an Amended & Restated ABL Credit Agreement by and among the Company, the several lenders from time to time parties thereto, JPMorgan Chase Bank, N.A., as Administrative Agent, Barclays Bank PLC, Bank of America, N.A. and Truist Securities, Inc. as Syndication Agents, and HSBC Securities (USA) Inc., as Documentation Agent (the “U.S. ABL Credit Agreement”). The U.S. ABL Credit Agreement provides for a U.S. asset-based revolving credit facility with committed maximum borrowing capacity of $150.0 million (the “New U.S. ABL Facility”) that amends and restates the Company’s existing $150.0 million U.S. asset-based revolving credit facility, which was scheduled to mature in June 2024. The New U.S. ABL Facility includes a letter of credit subfacility with a sublimit of $50 million, provided that at no time may amounts outstanding under the New U.S. ABL Facility exceed in the aggregate $150.0 million or the New U.S. ABL Facility bor
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Debt Financings SEC 8-K Item 2.03/2.04 confidence 0.95

TTM TECHNOLOGIES INC incurred term loan of $350.0 million with JPMorgan Chase Bank, N.A. at Term SOFR plus a margin of 2.75% maturing May 2030.

Instrument
term loan
Principal
$350.0 million
Counterparty
JPMorgan Chase Bank, N.A.
Rate
Term SOFR plus a margin of 2.75%
Maturity
May 2030
Event
incurrence
Exact text from the filing
Term Loan Credit Agreement On May 30, 2023 (the “Closing Date”), TTM Technologies, Inc. (the “Company”) entered into an Amended & Restated Term Loan Credit Agreement by and among the Company, JPMorgan Chase Bank, N.A., as Administrative Agent, and the several lenders from time to time parties thereto (the “Term Loan Credit Agreement”). The Term Loan Credit Agreement provides for a $350.0 million senior secured term loan credit facility (the “New Term Loan Facility”) that amends and restates the Company’s existing senior secured term loan credit facility that was due to expire in September 2024, under which $355.9 million of indebtedness was outstanding. In addition, the Term Loan Credit Agreement will permit the Company to add one or more senior secured incremental term loan facilities to the New Term Loan Facility subject to the satisfaction of certain conditions. On the Closing Date, the Company used $350.0 million under the New Term Loan Facility, together with cash on hand, to refi
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Material Agreements SEC 8-K Item 1.01/1.02 confidence 0.9

TTM TECHNOLOGIES INC entered into "U.S. ABL Credit Agreement" with JPMorgan Chase Bank, N.A., as Administrative Agent, Barclays Bank PLC, Bank of America, N.A. and Truist Securities, Inc. as Syndication Agents, and HSBC Securities (USA) Inc., as Documentation Agent valued at $150.0 million (effective 2023-05-30).

Action
entry
Agreement
credit facility
Counterparty
JPMorgan Chase Bank, N.A., as Administrative Agent, Barclays Bank PLC, Bank of America, N.A. and Truist Securities, Inc. as Syndication Agents, and HSBC Securities (USA) Inc., as Documentation Agent
Value
$150.0 million
Effective
2023-05-30
Exact text from the filing
On May 30, 2023, the Company entered into an Amended & Restated ABL Credit Agreement by and among the Company, the several lenders from time to time parties thereto, JPMorgan Chase Bank, N.A., as Administrative Agent, Barclays Bank PLC, Bank of America, N.A. and Truist Securities, Inc. as Syndication Agents, and HSBC Securities (USA) Inc., as Documentation Agent (the “U.S. ABL Credit Agreement”).
View on SEC.gov
Material Agreements SEC 8-K Item 1.01/1.02 confidence 0.9

TTM TECHNOLOGIES INC entered into "Term Loan Credit Agreement" with JPMorgan Chase Bank, N.A., as Administrative Agent, and the several lenders from time to time parties thereto valued at $350.0 million (effective 2023-05-30).

Action
entry
Agreement
credit facility
Counterparty
JPMorgan Chase Bank, N.A., as Administrative Agent, and the several lenders from time to time parties thereto
Value
$350.0 million
Effective
2023-05-30
Exact text from the filing
On May 30, 2023 (the “Closing Date”), TTM Technologies, Inc. (the “Company”) entered into an Amended & Restated Term Loan Credit Agreement by and among the Company, JPMorgan Chase Bank, N.A., as Administrative Agent, and the several lenders from time to time parties thereto (the “Term Loan Credit Agreement”).
View on SEC.gov

8 debt financings filed in the last 30 days. Browse all debt financings →

TTM TECHNOLOGIES INC filing history →

Source: SEC EDGAR
accession 0001193125-23-156582
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