Extracted from this filing and checked against the source text.
Debt Financings
SEC 8-K Item 2.03/2.04
confidence 0.9
TTM TECHNOLOGIES INC amended credit facility with The Hong Kong and Shanghai Banking Corporation Limited at 1.3% maturing June 13, 2028.
- Instrument
- credit facility
- Counterparty
- The Hong Kong and Shanghai Banking Corporation Limited
- Rate
- 1.3%
- Maturity
- June 13, 2028
- Event
- amendment
Exact text from the filing
On June 14, 2023, TTM Technologies China Limited (“TTMC”) and TTM Technologies Trading (Asia) Company Limited (“TTMTA”), each of which are wholly-owned subsidiaries of TTM Technologies, Inc. (the “Company”), entered into an amended and restated facility agreement, effective as of June 30, 2023 (the “Facility Agreement”), which amends and restates the Asia asset backed loan facility agreement dated May 22, 2015 and amended and restated on June 4, 2019 (the “Asia ABL Agreement”) entered into by and among TTMC, TTMTA and other parties as original guarantors, The Hong Kong and Shanghai Banking Corporation Limited as arranger, original lender, facility agent, security trustee and issuing bank and Barclays Bank PLC as original lender.
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Material Agreements
SEC 8-K Item 1.01/1.02
confidence 0.9
TTM TECHNOLOGIES INC amended Facility Agreement with The Hong Kong and Shanghai Banking Corporation Limited (effective 2023-06-30).
- Action
- amendment
- Agreement
- credit facility
- Counterparty
- The Hong Kong and Shanghai Banking Corporation Limited
- Effective
- 2023-06-30
Exact text from the filing
On June 14, 2023, TTM Technologies China Limited (“TTMC”) and TTM Technologies Trading (Asia) Company Limited (“TTMTA”), each of which are wholly-owned subsidiaries of TTM Technologies, Inc. (the “Company”), entered into an amended and restated facility agreement, effective as of June 30, 2023 (the “Facility Agreement”), which amends and restates the Asia asset backed loan facility agreement dated May 22, 2015 and amended and restated on June 4, 2019 (the “Asia ABL Agreement”) entered into by and among TTMC, TTMTA and other parties as original guarantors, The Hong Kong and Shanghai Banking Corporation Limited as arranger, original lender, facility agent, security trustee and issuing bank and Barclays Bank PLC as original lender.
View on SEC.gov