Applied Materials buys 9% stake in BE Semiconductor Industries to boost hybrid bonding

APPLIED MATERIALS INC /DE

Purchased 9% of Besi's outstanding common stock through market-based transactions; no regulatory approvals needed.
Companies have collaborated since 2020 on hybrid bonding; recently extended co-development agreement for die-based hybrid bonding.
Applied does not intend to seek board representation or purchase additional Besi shares.
Hybrid bonding critical for advanced packaging of AI chips, improving performance, power, and cost.

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