NXP and VIS announce $7.8B joint venture to build 300mm wafer fab in Singapore

NXP Semiconductors N.V.

NXP to invest $1.6B for 40% equity in JV VisionPower Semiconductor; VIS invests $2.4B for 60%.
Total initial build-out cost $7.8B; additional $1.9B committed for long-term capacity infrastructure.
Construction starts H2 2024; initial production target 2027; full capacity 55k wafers/month by 2029.
Fab will produce 130nm to 40nm mixed-signal/analog chips for automotive, industrial, consumer, mobile markets.
JV to create ~1,500 jobs in Singapore; technology licensed from TSMC.

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