NXP enters $250M EIB facility to expand Malaysia back-end manufacturing

NXP Semiconductors N.V.

NXP B.V., a wholly owned direct subsidiary of NXP Semiconductors N.V. (NXPI), entered a $250.0M unsecured senior loan facility with the European Investment Bank (EIB) on Sept 1, 2026.
Proceeds will fund design and implementation of an expansion of an existing semiconductor assembly and test (back-end) facility in Kuala Lumpur, Malaysia.
The facility is fully and unconditionally guaranteed by NXP Semiconductors N.V., NXP Funding LLC, and NXP USA, Inc.
Borrowings may be USD or EUR denominated, carry fixed or floating rates, and have a maximum tenor of six years.

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