MDLK ModuLink Inc.

CIK 0001611046 8 ready 8-Ks latest October 31, 2025, 7:59 PM ET RSS · JSON

Activity: NORMAL 2 filings / 30d vs 1 baseline

Ready 8-Ks 8

Latest filing May 8, 2026, 7:59 PM ET

Top materiality 0.60

Event mix m_and_a ×3 · other_material ×3 · other ×1

Sentiment 2 pos · 0 neg · 6 neu

Executive change recent →

Recent 8-K filings for MDLK

Highest-materiality recent filing

International Endeavors plans name change to ModuLink Inc. and authorized share increase from 4B to 6B

October 31, 2025, 7:59 PM ET other material materiality 0.60 neutral item 7.01 item 9.01

Files amendment to change name to "ModuLink Inc." and increase authorized shares from 4B to 6B.
Effectiveness depends on SEC review of preliminary Info Statement on Schedule 14C and 20-day waiting period.

Read filing →

October 31, 2025, 7:59 PM ET other material materiality 0.60 neutral item 7.01 item 9.01

International Endeavors plans name change to ModuLink Inc. and authorized share increase from 4B to 6B

Files amendment to change name to "ModuLink Inc." and increase authorized shares from 4B to 6B.

Executive changes

Appointed

Dr. Henry Wah Shing Lam

Chief Technology Officer

MDLK · ModuLink Inc.

Effective: 2026-05-01
Filed: May 6, 2026, 7:59 PM ET

On May 1, 2026, ModuLink Inc. (the “Company”) appointed Dr. Henry Wah Shing Lam (“Dr. Lam”), aged 31, as Chief Technology Officer (“CTO”) of the Company.

Materiality & sentiment trend

Max materiality 0.60 · Median 0.50 · Most common event m_and_a

2 positive 0 negative 6 neutral

source · MDLK on sec.gov