secwatch / observer
8-K filed May 2, 2024, 7:59 PM ET CIK 0000808326
other material confidence high sentiment negative materiality 0.85

EMCORE CORP: M&A transaction — EMCORE sells Chips business for $2.92M, enters forbearance agreement with new lenders

EMCORE CORP

Executive movements

Machine-extracted from this filing. Every card cites the SEC source. See all recent executive movements.

Departed

Rex S. Jackson

Director
EMCORE CORP
Effective
2024-04-29
Filed
May 2, 2024, 7:59 PM ET
On April 29, 2024, Rex S. Jackson resigned from the Company’s Board of Directors effective on April 29, 2024.

Key facts

Extracted from this filing and checked against the source text.

Debt Financings SEC 8-K Item 2.03/2.04 confidence 0.4

EMCORE CORP amended credit facility with Wingspire Capital LLC.

Instrument
credit facility
Counterparty
Wingspire Capital LLC
Event
amendment
Exact text from the filing
The disclosures regarding the Credit Agreement, the Appointment of Agent and Assignment of Financing Documents Agreement and the Forbearance Agreement set forth in Item 1.01 above are incorporated by reference into this Item 2.03.
View on SEC.gov
Executive change SEC 8-K Item 5.02 confidence 0.95

Rex S. Jackson resigned as Director at EMCORE CORP.

Action
resigned
Role
Director
Exact text from the filing
On April 29, 2024, Rex S. Jackson resigned from the Company’s Board of Directors effective on April 29, 2024.
View on SEC.gov
M&A Transactions SEC 8-K Item 2.01/5.01 confidence 0.9

EMCORE CORP completed a disposition involving HieFo Corporation for $2.92 million in cash and assumption by the Buyer of the Assumed Liabilities (closed 2024-04-30).

Action
disposition
Counterparty
HieFo Corporation
Consideration
$2.92 million in cash and assumption by the Buyer of the Assumed Liabilities
Closing
2024-04-30
Exact text from the filing
and inventory, including without limitation the Company’s indium phosphide wafer fabrication equipment (the “ Transaction ”), in consideration for a purchase price equal to $2.92 million in cash and assumption by the Buyer of the Assumed Liabilities (as defined in the Purchase Agreement), $1 million of which was previously received by the Company in connection
View on SEC.gov
Material Agreements SEC 8-K Item 1.01/1.02 confidence 0.9

EMCORE CORP entered into Assignment Agreement with Wingspire Capital LLC, HCP-FVU, LLC, HCP Fund V-FVU, LLC, Bessel Holdings LLC (effective 2024-04-29).

Action
entry
Agreement
credit facility
Counterparty
Wingspire Capital LLC, HCP-FVU, LLC, HCP Fund V-FVU, LLC, Bessel Holdings LLC
Effective
2024-04-29
Exact text from the filing
On April 29, 2024, Wingspire Capital LLC (“ Wingspire ”) as lender (the “ Prior Lender ”) under the Credit Agreement, dated August 9, 2022, by and among the Company, EMCORE Space & Navigation Corporation and EMCORE Chicago Inertial Corporation (individually and collectively referred to as the “ Borrowers ”), the Lenders from time to time party thereto and Wingspire, as Agent (the “ Prior Agent ”), as amended by the First Amendment to Credit Agreement, dated October 25, 2022, by and among the Borrower, the Lenders party thereto and Agent (the “ First Amendment ”) (as further amended, supplemented, amended and restated or otherwise modified and in effect from time to time, the “ Credit Agreement ”) and HCP-FVU, LLC, HCP Fund V-FVU, LLC and Bessel Holdings LLC (each an affiliate of Hale Capital Management, L.P. and collectively, “ Hale ” or “ New Lenders ”) and HCP-FVU, LLC as administrative agent for New Lenders, have entered into that certain Assignment Agreement dated as of April 29, 2
View on SEC.gov
Material Agreements SEC 8-K Item 1.01/1.02 confidence 0.9

EMCORE CORP entered into Asset Purchase Agreement with HieFo Corporation valued at $2.92 million in cash (effective 2024-04-30).

Action
entry
Agreement
asset purchase
Counterparty
HieFo Corporation
Value
$2.92 million in cash
Effective
2024-04-30
Exact text from the filing
EMCORE Corporation (the " Company ") entered into an Asset Purchase Agreement (the " Purchase Agreement "), by and among the Company and HieFo Corporation, a Delaware corporation (the " Buyer "), pursuant to which the Company agreed to transfer to the Buyer substantially all of the assets primarily related to the Company’s non-core discontinued Chips business line
View on SEC.gov

312 debt financings filed in the last 30 days. Browse all debt financings →

Source: SEC EDGAR
accession 0001104659-24-056375
Machine-readable: JSON · Markdown · Plain text

This headline and bullets were generated automatically by deepseek-v4-flash:cloud@v2 from the public filing. Read the source on SEC.gov before relying on any specific claim. Not investment advice. See methodology for how this pipeline works.