SmartKem signs preliminary JDA with Manz Asia for AI chip packaging dielectric inks

SmartKem, Inc.

Preliminary, non-binding Joint Development Agreement with Manz Asia for dielectric ink solutions in advanced packaging.
Focus on co-developing next-gen dielectric inks for AI chip packaging and 12" wafer-level and panel-level packaging.
Builds on existing collaboration; first demonstration at SEMICON SEA 2025 of an inkjet metalization process.
No assurance that a definitive development agreement will be executed or as to ultimate terms or outcome.

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