Resideo completes $1.59B Honeywell payment, eliminates $140M annual obligations; issues $1.225B debt

RESIDEO TECHNOLOGIES, INC.

Paid $1.59B to Honeywell to terminate Indemnification Agreement; eliminates up to $140M annual payments through 2043.
Issued $1.225B incremental term loans at SOFR+2.00%, maturing August 13, 2032.
Interest rate on existing Term B loans increased from SOFR+1.75% to SOFR+2.00%.
Total leverage ratio covenant temporarily raised to 4.00x for Q3 and Q4 2025.
Other Honeywell agreements, including Honeywell Home brand license, remain in effect.

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