RESIDEO TECHNOLOGIES, INC. (REZI): debt financing — Resideo completes $1.59B Honeywell payment, eliminates $140M annual obligations; issues $1.225B debt

RESIDEO TECHNOLOGIES, INC.

Paid $1.59B to Honeywell to terminate Indemnification Agreement; eliminates up to $140M annual payments through 2043.
Issued $1.225B incremental term loans at SOFR+2.00%, maturing August 13, 2032.
Interest rate on existing Term B loans increased from SOFR+1.75% to SOFR+2.00%.
Total leverage ratio covenant temporarily raised to 4.00x for Q3 and Q4 2025.
Other Honeywell agreements, including Honeywell Home brand license, remain in effect.

item 1.01 item 1.02 item 2.03 item 7.01 item 9.01

Key facts

Extracted from this filing and checked against the source text.

Debt Financings SEC 8-K Item 2.03/2.04 confidence 0.9

RESIDEO TECHNOLOGIES, INC. amended credit facility with JPMorgan Chase Bank, N.A. at Term SOFR plus 2.00%.

Instrument: credit facility
Counterparty: JPMorgan Chase Bank, N.A.
Rate: Term SOFR plus 2.00%
Event: amendment

Exact text from the filing

increase the interest rate on the Existing Term B Tranches from Term SOFR plus 1.75% to Term SOFR plus 2.00%

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Debt Financings SEC 8-K Item 2.03/2.04 confidence 0.9

RESIDEO TECHNOLOGIES, INC. incurred term loan of $1.225 billion with JPMorgan Chase Bank, N.A. at Term SOFR plus 2.00% maturing August 13, 2032.

Instrument: term loan
Principal: $1.225 billion
Counterparty: JPMorgan Chase Bank, N.A.
Rate: Term SOFR plus 2.00%
Maturity: August 13, 2032
Event: incurrence

Exact text from the filing

the Company obtained incremental senior secured term loans with a seven-year maturity and an interest rate of Term SOFR plus 2.00% in an aggregate principal amount of $1.225 billion

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RESIDEO TECHNOLOGIES, INC. filing history →

Source: SEC EDGAR

accession 0001193125-25-180358

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