Aeluma signs CHIPS Act LOI for up to $30M from U.S. Department of Commerce for photonics R&D

Aeluma, Inc.

Signed LOI with U.S. Department of Commerce for up to $30M in CHIPS Act funding for R&D of non-InP photonics platform.
Funding aims to accelerate scalable manufacturing of photonic components for AI datacom, addressing supply chain constraints.
Award subject to due diligence, government approvals, and execution of definitive documents; portion funded upfront, rest milestone-based.
Aeluma would issue equity securities to Department of Commerce equal to award amount upon finalization.
Company's non-InP large-diameter substrate platform (up to 300mm) targets high-speed photodetectors and lasers for AI interconnects.

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